Monthly Archives: February 2010

BGA Solder Joint Failure (pad cratering) on RoHS PC

I’ve been working on a new project using the Intel Atom processor and 945GSE chipset.  In the platform design guide that Intel published they have various recommendations for routing traces to the corners of BGA PCB footprints for the parts and I was curious as to why these were being recommended.   It turns out […]

Welcome to FOM Systems

Hello, and welcome to the new FOM Systems web site. The site is still under construction as some content needs to be migrated from the old site, so please bear with us for a little while. This blog category is dedictated to pcb design issues as well as tips and tricks for CADSTAR users. Maybe […]